• Description
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Description:

  • Board Layer: 2L
  • Material: FR4 Tg135
  • Board Thickness: 1.0mm
  • Copper Thickness: 1OZ
  • Solder mask: Black
  • Silkscreen: White
  • Surface Finished: OSP
  • Test: 100% E-test
  • Application: Power supply
  • Service:  one stop solution from PCB manufacturing, components sourcing and PCB assembly
  • DIP and SMD service
  • Components purchasing
  • MOQ: no

 

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PCB  Capability:

Item Manufacture Capability
Layers 1-30 Layers
Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers, Isola, Taconic, Arlon Teflon,  Aluminum Based,Copper Based PCB
Max. Panel Dimension 39000mil * 47000mil  / 1000mm * 1200mm
Outline Tolerance ± 4mil ± 0.10mm
Board Thickness 8mil-236mil
Board Thickness Tolerance mil-236mil / 0.2mm-6.0mm
Board Thickness Tolerance ± 10%
Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm
Min. Track Width 3mil / 0.075mm
Min. Track Space 3mil / 0.075mm
External Cu Thickness HOZ-6OZ / 17um~210um
Internal Cu Thickness HOZ-6OZ / 17um~210um
Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm
Finished Hole Dimension 4mil-236mil / 0.1mm_6.0mm
Hole Tolerance ± 2mil / ± 0.05mm
Hole Position Tolerance ± 2mil / ± 0.05mm
Laser Drilling Hole Size 4mil / 0.1mm
Aspect Ration 12:01
Solder Mask Green, Blue, White, Black, Red, Yellow, Purple, etc.
Min Solder mask Bridge 2mil / 0.050mm
Plugged Hole Diameter 8mil-20mil/ 0.20mm-0.50mm
Impedance Control V-scoring Min ±5%, General ±10%
Surface Finishing HASL, HASL(lead Free), Immersion Gold, Immersion Tin, Immersion Silver, OSP, Hard Gold( up to 100u” )

 

 

 






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