Single Side Copper Based MCPCB with ENIG finished

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  • Inquiry

Description:

  • Board Layer: 1L
  • Material: Copper
  • Board Thickness: 1.00mm
  • Copper Thickness: 1OZ
  • Solder mask: white
  • Silkscreen: black
  • Surface Finished: ENIG
  • Test: 100% E-test
  • Application: Industry control
  • Service:  one stop solution from PCB manufacturing, components sourcing and PCB assembly
  • DIP and SMD service
  • Components purchasing
  • MOQ: no

 

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PCB Capability:

Materials Aluminum, Copper
Maximum Lager Count 4 Layers
Maximum Panel Size 17” x 23” (432 x 584 mm2)
Min. Board Thickness 0.8mm
Copper Clad (inner) 1/2 oz, 1 oz, 2 oz, 3 oz, 4oz
Copper Clad (outer) 1/2 oz, 1 oz, 2 oz, 3 oz, 4 oz
Surface Finishes Immersion Gold, HASL-LF, immersion silver, OSP
Solder Mask White, Black, Green, Blue etc
Minimum Trace (width) 12.0 mils (0.30 mm)
Minimum Trace (spacing) 12.0 mils (0.30 mm)
Minimum PAD-TO-PAD TOL. ± 3 mils (± 0.76 mm)
Hole Size Tolerance (NPTH) ± 2 mils (± 0.05 mm)
Hole Size Tolerance (PTH) ± 3 mils (± 0.076 mm)
Minimum Hole Size 20 mils (0.50 mm)
Outline Dimensional Tol. < ± 10 mils (0.25 mm)
Ionic Cleanliness < 5 mg/in2 of NaCl (0.775 mg/cm2)
Impedance Control ± 10% (Differential)
Warpage < 1%

 

 






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