Single Side Copper Based MCPCB with ENIG finished
- Description
- Inquiry
Description:
- Board Layer: 1L
- Material: Copper
- Board Thickness: 1.00mm
- Copper Thickness: 1OZ
- Solder mask: white
- Silkscreen: black
- Surface Finished: ENIG
- Test: 100% E-test
- Application: Industry control
- Service: one stop solution from PCB manufacturing, components sourcing and PCB assembly
- DIP and SMD service
- Components purchasing
- MOQ: no
Product Show:
PCB Capability:
| Materials | Aluminum, Copper |
| Maximum Lager Count | 4 Layers |
| Maximum Panel Size | 17” x 23” (432 x 584 mm2) |
| Min. Board Thickness | 0.8mm |
| Copper Clad (inner) | 1/2 oz, 1 oz, 2 oz, 3 oz, 4oz |
| Copper Clad (outer) | 1/2 oz, 1 oz, 2 oz, 3 oz, 4 oz |
| Surface Finishes | Immersion Gold, HASL-LF, immersion silver, OSP |
| Solder Mask | White, Black, Green, Blue etc |
| Minimum Trace (width) | 12.0 mils (0.30 mm) |
| Minimum Trace (spacing) | 12.0 mils (0.30 mm) |
| Minimum PAD-TO-PAD TOL. | ± 3 mils (± 0.76 mm) |
| Hole Size Tolerance (NPTH) | ± 2 mils (± 0.05 mm) |
| Hole Size Tolerance (PTH) | ± 3 mils (± 0.076 mm) |
| Minimum Hole Size | 20 mils (0.50 mm) |
| Outline Dimensional Tol. | < ± 10 mils (0.25 mm) |
| Ionic Cleanliness | < 5 mg/in2 of NaCl (0.775 mg/cm2) |
| Impedance Control | ± 10% (Differential) |
| Warpage | < 1% |
