• Description
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Description:

  • Board Layer: 2L
  • Material: Polyimide
  • Board Thickness: 0.2mm
  • Copper Thickness: 1OZ
  • Solder mask: Yellow
  • Silkscreen: White
  • Surface Finished: ENIG
  • Test: 100% E-test
  • Application: Smart electronics
  • Service:  one stop solution from PCB manufacturing, components sourcing and PCB assembly
  • DIP and SMD service
  • Components purchasing
  • MOQ: no

 

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PCB Assembly Capability:

PCBA Manufacturing Capabilities
Types of Assembly THD (Thru-Hole Device) ; SMT (Surface-Mount Technology) ; SMT & THD mixed ; 2 sided SMT and THD assembly
SMT Line Quantity 5
Smallest SMT Components 1005
SMT Min Pitch-QFP 0.3mm
BGA-Min Pitch 0.25mm
Component Package Reels ; Cut tape ;Tube and tray ;Loose parts and bulk
Board dimensions Smallest size: 50*50mm   ; Largest size: 520*420mm
Board shape Rectangular ; Round ;Slots and Cut outs ;Complex and Irregular
Board type Rigid FR-4 ; Rigid-Flex boards ; Aluminum PCB; FPC etc
Assembly process Lead-Free (RoHS)
Design file format Gerber RS274X  ; BOM (Bill of Materials) (.xls, .csv, . xlsx) Centroid(Pick-N-Place/XY file)
Testing Procedures   Visual inspection ; X-ray Inspection ;AOI (Automated Optical Inspection) ; ICT (In-Circuit Test) ;  Functional testing
Turnaround time 1-5 days for only PCB assembly ; 10-16 days for full turn-key PCB assembly